A novel 3D stacking method for Opto-electronic dies on CMOS ICs
نویسندگان
چکیده
منابع مشابه
Wet etched silicon interposer for the connection of CMOS ICs and optoelectronic dies
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ژورنال
عنوان ژورنال: Optics Express
سال: 2012
ISSN: 1094-4087
DOI: 10.1364/oe.20.00b386